The Zhuque AI chips represent a new component in the arsenal of Huawei’s HiSilicon unit and a daring departure from China’s semiconductor playbook. Zhuque AI chips signify a further Huawei move toward vertical integration with an eye towards domestic supply chain robustness, in an age of increasing US-China tech competition. By launching these chips, Huawei is getting ready to shake a global market that until now has been monopolised by Taiwanese firms such as Novatek and Raydium.
The Zhuque AI-Touch is the first-ever touch controller chip equipped with embedded AI processing, launched by Huawei’s in-house semiconductor division HiSilicon. The chip is based on a dual-core RISC-V architecture that can run on a dry-core interpreter that enables it to interpret complex usage scenarios including wet-hands, pocket, and environmental-noise touch events in real-time. It redefines the Zhuque AI chips in the high-end smartphones sector.
Zhuque AI chips are now being tested in Huawei mid- and high-end products They will be deployed on flagship smartphones at first, after which we expect to see intelligence infiltrating into Chinese OEMs, which will further expand the localization of touch IC components.
For something not related to touch controllers you should take a look at the Zhuque OLED solution from HiSilicon which is also making some noise in the OLED driver IC market. Following up on AWE 2025 launch, this chip combines dual-layer OLED + LTPO local dimming with an AI optical engine to provide dynamic brightness, color, and refresh rate control. This innovation positions Zhuque AI chips in the forefront of integrated hardware and software display.
The uniqueness of the Zhuque AI chips comes from their system-level design, powered by AI and real-time algorithms. Utilizing fully functional RISC-V and a hybrid analog-digital architecture, HiSilicon hopes to overtake Novatek and Raydium — the current worldwide leaders — in traditional display ICs.
The Zhuque AI chips from HiSilicon are part of its wider “5+2” chip strategy. “Zhuque” in the name figures into five major HiSilicon chip lines, with Balong (wireless), Lingxiao (networking), Honghu (display), and Yueying (image) filling the other four. They include NearLink as a foundational layer for IoT and AI computing as a foundational layer for edge processing, all under Huawei vertical integration strategy.
This is important because Zhuque AI chips are indeed a strategic weapon to enhance China’s journey towards semiconductor self-sufficiency, and this holistic approach explains it all. Huawei is also looking to curb outsized needs on foreign suppliers through internalizing features such as AI deep into the process of chip design, and collaborations with local panels manufacturers, such as BOE Technology and TCL CSOT.
Zhuque AI chips also reflect a general trend: In mid- and high-end smartphones, AI-powered capabilities have become a necessary factor of competition. Brands will be squeezed out of the market by brands adopting AI-centric solutions if they do not keep up with this evolution.
Taiwan’s historic strength in TDDI and OLED IC may soon be pitted against its greatest challenge, as HiSilicon launches more products under the Zhuque AI chips umbrella. This possibility is only further reinforced by Huawei’s return to the pole position in the Chinese smartphone landscape.
Huawei isn’t just making components with its Zhuque AI chips, it’s rewriting the paradigms of chip design, innovation and integration.
FAQ
The Zhuque AI chips is a new generation of Huawei HiSilicon touch and display ICs, which incorporate AI-enabled real-time processing and are built on a RISC-V architecture.
The main rivals are domestic competitors Novatek and Raydium, both of which are currently leading the global OLED driver IC market.
With embedded AI on RISC-V cores, it is also the first AI touch controller recognizing wet-hand input, raindrops, or pocket touches.
These combine both dual layer OLED and LTPO dimming and AI-enabled pixel control, going up against the growing troop of established technologies.
To achieve localization of the supply chain, encourage innovation, and leverage AI as a differentiator in smart phones.
