Another is the slowdown that mobile users often experience because of overheating, particularly when using AI-intensive apps. SK hynix just launched a next generation mobile DRAM, its concept thermal efficiency will help solve this problem.
The new mobile DRAM of SK hynix has increased thermal conductivity by 3.5 times, smoothly operating smartphones. Utilizing a sector-first High-K Epoxy Molding Compound, the move by SK hynix is once again revolutionizing mobile DRAM development. The company says that this material substantially increases heat transfer and decreases vertical heat resistance by 47 per cent.
Mobile DRAM is frequently stacked on top of the chipset die in a bid to save space and speed up the transferring of data. But this configuration can, in highly demanding situations, be prone to overheating. SK hynix said its customers deploying the new material will experience better performance, a longer battery life, and decrease in performance degradation caused by overheating in their smartphones with the mobile DRAM inside them.
Lee Gyu-jei, head of Package Product Development at SK hynix, pointed out that the progress in mobile DRAM is not only about performance. He dubbed it a “significant accomplishment” as it solves overheating issues experienced by high-performance smartphone users, reconfirming SK hynix’s leadership in mobile DRAM technology.
The Korea Herald reports that SK hynix accomplished this by adding Silica to Alumina in its Epoxy Molding Compound, which significantly boosted thermal conductivity. This change in material enable mobile DRAM to function in more efficient manner under harsh enviornments.
There is no available schedule for mass production from SK hynixIndustry officials say that the new mobile DRAM can be adopted for flagship smartphones which are expected to be released in 2026 at the earliest. If widely adopted, this could change how smartphones process AI workloads and determine gaming performance.
FAQ
Mobile DRAM is the memory found in smartphones that is used for data intensive applications. This is important for AI, gaming and multitasking performance.
The enhanced mobile DRAM supports 3.5 times faster thermal conductivity to combat overheating and maintain performance levels under heavy use.
There is no specific timing, but experts predict that 2026 premium smartphones will be equipped with this high-spec mobile DRAM.
