Co-Packaged Optics at OCP APAC 2025: ASE Leads AI-Driven Chip Innovation
The transformation by artificial intelligence is relentless, and there will be before and after Co-Packaged Optics became a cornerstone technology for it in the semiconductor landscape. Co-Packaged Optics (CPO) emerged as a key solution to the bandwidth, thermal and performance challenges of AI at the OCP APAC 2025 Summit in Taipei ASE Inc. spotlighted CPO … Read more
