ASE Group Executive Vice President Tingu Yin Chang made a provocative move at the first Open Compute Project (OCP) APAC Summit in Taipei announcing ASE’s co-packaged optics (CPO) program as a competitor to TSMC’s silicon photonics dominance. With heightened global demand for AI computing, not only the semiconductor industry need to scale up, but also … Read more
The transformation by artificial intelligence is relentless, and there will be before and after Co-Packaged Optics became a cornerstone technology for it in the semiconductor landscape. Co-Packaged Optics (CPO) emerged as a key solution to the bandwidth, thermal and performance challenges of AI at the OCP APAC 2025 Summit in Taipei ASE Inc. spotlighted CPO … Read more
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